Sensor package structure

ABSTRACT

A sensor package structure includes a substrate, a sensor chip disposed on the substrate, several metal wires electrically connected to the substrate and the sensor chip, a translucent layer corresponding in position to the sensor chip, and an adhesive. A top surface of the sensor chip has a sensing region and a spacing region around the sensing region. The sensor chip includes several connecting pads arranged on a first portion of the top surface between the first edge and the spacing region, and a second portion of the top surface between the second edge and the spacing region is provided without any connecting pad. The width of the first portion is greater than that of the second portion. The adhesive covers the surrounding side of the sensor chip, the first portion, and the surrounding side of the translucent layer. Part of each metal wire is embedded in the adhesive.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a package structure; in particular, toa sensor package structure.

2. Description of Related Art

Electronic components within a conventional electronic device need to bedeveloped toward being smaller in size, such that more electroniccomponents can be disposed within the conventional electronic device.However, the conventional sensor package structure (e.g., an imagesensor package structure) is not suitable for packaging a sensor chip ofsmaller size, rendering the task of miniaturization a difficult one.

SUMMARY OF THE INVENTION

The present disclosure provides a sensor package structure foreffectively improving the drawbacks associated with conventional sensorpackage structures.

The present disclosure provides a sensor package structure. The sensorpackage structure includes a substrate, a sensor chip, a plurality ofmetal wires, a first combining layer, a second combining layer, atranslucent layer, and a packaging compound. The substrate has an uppersurface and a lower surface opposite to the upper surface. The substrateincludes a plurality of welding pads formed on the upper surface. Thesensor chip has a top surface and a bottom surface opposite to the topsurface, and the bottom surface of the sensor chip is disposed on theupper surface of the substrate. The top surface has a sensing region anda spacing region arranged around the sensing region. The top surface hasat least one first edge and at least one second edge, the sensor chipincludes a plurality of connecting pads formed on a first portion of thetop surface between the at least one first edge and the spacing region;and a second portion of the top surface between the at least one secondedge and the spacing region is provided without any connecting pad. Oneends of the metal wires are respectively connected to the welding pads,and the other ends of the metal wires are respectively connected to theconnecting pads. The first combining layer is disposed on the firstportion of the top surface between the at least one first edge and thespacing region. The second combining layer is disposed on the secondportion of the top surface and arranged adjacent to the at least onesecond edge. A height of the second combining layer with respect to theupper surface is substantially equal to that of the first combininglayer with respect to the upper surface. The translucent layer has afirst surface and a second surface opposite to the first surface, and aportion of the second surface of the translucent layer is adhered to thefirst combining layer and the second combining layer. The packagingcompound is disposed on the upper surface of the substrate and covers asurrounding side of the sensor chip, an outer side of the firstcombining layer, an outer side of the second combining layer, and asurrounding side of the translucent layer. At least part of each of themetal wires and each of the welding pads are embedded in the packagingcompound.

Exemplarily, the outer side of the first combining layer arrangeddistant from the sensing region includes an arc surface having a centerof circle located in the packaging compound.

Exemplarily, in a cross-section of the sensor package structureperpendicular to the upper surface, the outer side of the secondcombining layer arranged distant from the sensor chip is in an S-shape.

Exemplarily, a distance between the outer side of the second combininglayer and the sensing region is substantially equal to a distancebetween the at least one first edge and the sensing region.

Exemplarily, the second combining layer is further disposed on thesecond portion of the top surface between the at least one second edgeand the spacing region.

Exemplarily, an area of the second portion of the top surface is smallerthan that of a portion of the spacing region connected to the secondportion of the top surface.

Exemplarily, a distance between the at least one first edge and thespacing region is greater than a distance between the at least onesecond edge and the spacing region.

Exemplarily, a projecting area defined by orthogonally projecting thesensor chip onto the second surface is entirely located in the secondsurface. The second surface has a fixing region arranged outside theportion of the second surface adhered to the first combining layer andthe second combining layer, and the packaging compound covers the fixingregion.

Exemplarily, the packaging compound is a liquid compound, and the firstsurface of the translucent layer and an adjacent surface of thepackaging compound have an angle within a range of 90˜180 degrees.

Exemplarily, the sensor package structure further includes a moldingcompound disposed on a top surface of the packaging compound A topsurface of the molding compound is substantially parallel to the firstsurface, and a surrounding side surface of the molding compound iscoplanar with a surrounding side surface of the packaging compound.

Exemplarily, the packaging compound is a molding compound, and the firstsurface of the translucent layer and an adjacent surface of thepackaging compound have an angle of 180 degrees.

The present disclosure also provides a sensor package structure. Thesensor package structure includes a substrate, a sensor chip, aplurality of metal wires, a translucent layer, and an adhesive. Thesubstrate has an upper surface and a lower surface opposite to the uppersurface. The substrate includes a plurality of welding pads formed onthe upper surface. The sensor chip has a top surface and a bottomsurface opposite to the top surface, and the bottom surface of thesensor chip is disposed on the upper surface of the substrate. The topsurface has a sensing region and a spacing region arranged around thesensing region. The top surface has at least one first edge and at leastone second edge, and a distance between the at least one first edge andthe spacing region is greater than a distance between the at least onesecond edge and the spacing region. The sensor chip includes a pluralityof connecting pads formed on a first portion of the top surface betweenthe at least one first edge and the spacing region; and a second portionof the top surface between the at least one second edge and the spacingregion is provided without any connecting pad. One ends of the metalwires are respectively connected to the welding pads, and the other endsof the metal wires are respectively connected to the connecting pads.The translucent layer has a first surface and a second surface oppositeto the first surface, and the second surface of the translucent layerfaces toward the top surface of the sensor chip. The adhesive isdisposed on the upper surface of the substrate and covers a surroundingside of the sensor chip, the first portion of the top surface, and asurrounding side and a portion of the second surface of the translucentlayer. At least part of each of the metal wires and each of the weldingpads are embedded in the adhesive.

Exemplarily, the adhesive includes a supporting layer, a combininglayer, and a packaging compound. The supporting layer is arrangedadjacent to the at least one second edge. An edge of the supportinglayer arranged distant from the substrate has a height substantiallyequal to a height of the upper surface of the sensor chip. The combininglayer is disposed on the supporting layer and the first portion of thetop surface of the sensor chip. The portion of the second surface of thetranslucent layer is adhered to the combining layer. The packagingcompound is disposed on the upper surface of the substrate, and coversthe surrounding side of the sensor chip, an outer side of the supportinglayer arranged distant from the sensor chip, a surrounding side of thecombining layer arranged distant from the sensing region, and thesurrounding side of the translucent layer. At least part of each of themetal wires and each of the welding pads are embedded in the packagingcompound.

Exemplarily, the outer side of the supporting layer includes an arcsurface having a center of circle located at an interior side of thepackaging compound.

Exemplarily, the surrounding side of the combining layer includes an arcsurface having a center of circle located in the packaging compound.

Exemplarily, a distance between the surrounding side of the combininglayer and the sensing region is substantially equal to a distancebetween the at least one first edge and the sensing region.

Exemplarily, the combining layer is further disposed on the secondportion of the top surface between the at least one second edge and thespacing region.

Exemplarily, an area of the second portion of the top surface is smallerthan that of a portion of the spacing region connected to the secondportion of the top surface.

Exemplarily, a projecting area defined by orthogonally projecting thesensor chip onto the second surface is entirely located in the secondsurface, the second surface has a fixing region arranged outside theportion of the second surface adhered to the combining layer, and thepackaging compound covers the fixing region.

In summary, the sensor chip in the present disclosure, which has thesecond portion provided without any connecting pad, can be adapted inthe sensor package structure. That is to say, the sensor packagestructure of the present disclosure is suitable to package the sensorchip which has a smaller size.

In order to further appreciate the characteristics and technicalcontents of the present invention, references are hereunder made to thedetailed descriptions and appended drawings in connection with thepresent invention. However, the appended drawings are merely shown forexemplary purposes, and should not be construed as restricting the scopeof the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view showing a sensor package structureaccording to a first embodiment of the present disclosure;

FIG. 2 is a top view of FIG. 1 with the packaging compound, thetranslucent layer, and the metal wires omitted;

FIG. 3 is a top view of FIG. 1 with the packaging compound omitted;

FIG. 4 is a top view of FIG. 1 in another configuration according to thefirst embodiment with the packaging compound omitted;

FIG. 5A is an enlarged view of the VA portion of FIG. 1;

FIG. 5B is an enlarged view showing another configuration of FIG. 5Aaccording to the first embodiment;

FIG. 6 is an enlarged view of the VI portion of FIG. 1;

FIG. 7 is a cross-sectional view showing the sensor package structure inyet another configuration according to the first embodiment;

FIG. 8 is a cross-sectional view showing the sensor package structure inyet another configuration according to the first embodiment;

FIG. 9 is a cross-sectional view showing the sensor package structure inyet another configuration according to the first embodiment;

FIG. 10 is a cross-sectional view showing a sensor package structureaccording to a second embodiment of the present disclosure;

FIG. 11 is a top view showing a sensor package structure according to athird embodiment of the present disclosure; and

FIG. 12 is a cross-sectional view taken along a cross-sectional lineXII-XII of FIG. 11.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

References are hereunder made to the detailed descriptions and appendeddrawings in connection with the present invention. However, the appendeddrawings are merely provided for exemplary purposes, and should not beconstrued as restricting the scope of the present invention.

First Embodiment

Reference is made to FIGS. 1 to 9, which illustrate a first embodimentof the present disclosure. As shown in FIGS. 1 to 3, the presentembodiment provides, but is not limited to, a sensor package structure100 (i.e., an image sensor package structure 100). The sensor packagestructure 100 includes a substrate 1, a sensor chip 2 disposed on thesubstrate 1, a plurality of metal wires 3 establishing an electricalconnection between the substrate 1 and the sensor chip 2, a translucentlayer 4 corresponding in position to the sensor chip 2, and an adhesive5 firmly adhering the translucent layer 4 to the sensor chip 2 and thesubstrate 1. The following description discloses the structure andconnection relationships of each component of the sensor packagestructure 100.

As shown in FIGS. 1 and 2, the substrate 1 can be a plastic substrate, aceramic substrate, a lead frame, or a substrate made of other materials,but the present embodiment is not limited thereto. The substrate 1 hasan upper surface 11 and a lower surface 12 opposite to the upper surface11. The substrate 1 includes a plurality of welding pads 111 formed onthe upper surface 11. Moreover, the substrate 1 also includes aplurality of welding pads (not labeled) formed on the lower surface 12for respectively soldering a plurality of soldering balls (not labeled).In other words, the substrate 1 of the present embodiment exemplarilyhas a ball grid array (BGA) arrangement, but the present disclosure isnot limited thereto.

As shown in FIGS. 1 and 2, the sensor chip 2 in the present embodimentis exemplarily an image sensor chip, but the present disclosure is notlimited thereto. The sensor chip 2 has a top surface 21, a bottomsurface 22 opposite to the top surface 21, and a surrounding side 23perpendicularly connected to the top surface 21 and the bottom surface22. In the present disclosure, the surrounding side means the side(s)other than the top side and the bottom side. The top surface 21 has asensing region 211 and a spacing region 212 arranged around the sensingregion 211. The sensing region 211 in the present embodiment is in asquare shape or a rectangular shape. The center of the sensing region211 can be the center of the top surface 21 (as shown in FIG. 4), or thecenter of the sensing region 211 can be arranged apart from the centerof the top surface 21 at a distance (as shown in FIGS. 2 and 3). Thespacing region 212 in the present embodiment is in a square-ring shape,and each portion of the spacing region 212 has the same width. Thespecific shape of the spacing region 212 can be adjusted according topractical needs.

Specifically, the top surface 21 has at least one first edge 213 and atleast one second edge 214, and the first edge 213 and the second edge214 are arranged outside the spacing region 212. The surrounding side 23has at least one side surface 231 connected to the at least one secondedge 214. A distance D1 between the first edge 213 and the spacingregion 212 (as shown in FIG. 6) is greater than a distance D2 betweenthe second edge 214 and the spacing region 212 (as shown in FIG. 5A). Inthe present embodiment, the distance D2 is smaller than ⅓˜¼ of thedistance D1 (D2<⅓˜¼D1), but the ratio between the distance D1 and thedistance D2 can be adjusted according to practical needs. The sensorchip 2 includes a plurality of connecting pads 215 formed on a firstportion of the top surface 21 between the first edge 213 and the spacingregion 212, and a second portion of the top surface 21 between thesecond edge 214 and the spacing region 212 is provided without anyconnecting pad 215.

The top surface 21 can be formed with a plurality of first edges 213 anda single second edge 214 (as shown in FIG. 3), or the top surface 21 canalso be formed with a plurality of first edges 213 and a plurality ofsecond edges 214 (as shown in FIG. 4). In other words, FIG. 1 can be across-sectional view taken along a cross-sectional line IA-IA of FIG. 3or taken along a cross-sectional line IB-IB of FIG. 4. In otherembodiments of the present disclosure, the top surface 21 can be formedwith a single first edge 213 and a plurality of second edges 214.

Moreover, the bottom surface 22 of the sensor chip 2 is disposed on theupper surface 11 of the substrate 1, and a portion of the upper surface11 for mounting the sensor chip 2 is substantially arranged in a region,which is surroundingly defined by the welding pads 111. In the presentembodiment, the bottom surface 22 of the sensor chip 2 is fixed on theupper surface 11 of the substrate 1 by using a die attach epoxy (notlabeled), but the present disclosure is not limited thereto.

As shown in FIGS. 1 to 3, one ends of the metal wires 3 are respectivelyconnected to the welding pads 111 of the substrate 1, and the other endsof the metal wires 3 are respectively connected to the connecting pads215 of the sensor chip 2. In the present embodiment, each metal wire 3is in a reverse bond mode, and the top surface 21 of the sensor chip 2and an adjacent portion of each metal wire 3 (i.e., a portion of eachmetal wire 3 arranged above the top surface 21 as shown in FIG. 1) havean angle (not labeled) smaller than or equal to 45 degrees. Thus, anapex 31 of each metal wire 3 can be located at a lower height foravoiding contact with the translucent layer 4, but the presentdisclosure is not limited thereto. For example, the angle can be smallerthan or equal to 30 degrees.

As shown in FIGS. 1 to 3, the translucent layer 4 in the presentembodiment is exemplarily a glass plate, but is not limited thereto. Forexample, the translucent layer 4 can be a transparent plate or asemi-transparent plate. The translucent layer 4 has a first surface 41,a second surface 42 opposite to the first surface 41, and a surroundingside 43 perpendicularly connected to the first surface 41 and the secondsurface 42. In the present embodiment, the first surface 41 and thesecond surface 42 have the same square shape or the same rectangularshape, and an area of the second surface 42 is greater than that of thetop surface 21 of the sensor chip 2, but the present disclosure is notlimited thereto.

Moreover, the translucent layer 4 is fixed on the substrate 1 and thesensor chip 2 by using the adhesive 5, and the second surface 42 of thetranslucent layer 4 is substantially parallel to and faces toward thetop surface 21 of the sensor chip 2. Specifically, a projecting area(not labeled) defined by orthogonally projecting the sensor chip 2 ontothe second surface 42 is entirely located in the second surface 42. Inaddition, the second surface 42 of the translucent layer 4 is arrangedadjacent to, but does not contact with, each metal wire 3. The apex 31of each metal wire 3 is arranged outside a space defined by orthogonallyprojecting the translucent layer 4 to the substrate 1. As shown in FIGS.1 and 6, a height H1 of the apex 31 of each metal wire 3 with respect tothe top surface 21 of the sensor chip 2 is preferably smaller than aheight H2 of the second surface 42 of the translucent layer 4 withrespect to the top surface 21 of the sensor chip 2, but the presentdisclosure is not limited thereto.

As shown in FIGS. 1, 5A, and 6, the adhesive 5 can be a single piecemade of the same material or a composite piece made of differentmaterials, but the present embodiment is not limited thereto. Theadhesive 5 is disposed on the upper surface 11 of the substrate 1 andcovers the surrounding side 23 of the sensor chip 2, the first portionof the top surface 21 between the first edge 213 and the spacing region212, and the surrounding side 43 and a portion of the second surface 42of the translucent layer 4. At least part of each of the metal wires 3and each of the welding pads 111 are embedded in the adhesive 5.

Specifically, the adhesive 5 in the present embodiment includes asupporting layer 51, a combining layer 52, and a packaging compound 53,the three of which are connected with each other. The material of thesupporting layer 51 (i.e., a glass mount epoxy) is preferably to thesame as that of the combining layer 52, but the material of thepackaging compound 53 (i.e., a liquid compound) is preferably differentfrom that of the supporting layer 51. The following descriptiondiscloses the connection relationships of each part of the adhesive 5with respect to the other components.

As shown in FIGS. 1, 2 and 5A, the supporting layer 51 in the presentembodiment corresponds in shape and position to the second edge 214 ofthe top surface 21 of the sensor chip 2. For example, the supportinglayer 51 as shown in FIG. 3 is an elongated structure substantiallyparallel to the second edge 214, or the supporting layer 51 as shown inFIG. 4 includes two elongated structures respectively parallel to thetwo second edges 214. The supporting layer 51 is arranged adjacent tothe second edge 214 of the sensor chip 2 (i.e., the supporting layer 51contacts the side surface 231 of the sensor chip 2 connected to thesecond edge 214). An edge of the supporting layer 51 (i.e., the top edgeof the supporting layer 51 as shown in FIG. 5A) arranged distant fromthe substrate 1 has a height substantially equal to a height of the topsurface 21 (or the second edge 214) of the sensor chip 2.

Specifically, an outer side 511 of the supporting layer 51 arrangeddistant from the sensor chip 2 includes an arc surface 511 having acenter of circle (not labeled) located at an interior side of thepackaging compound 53 (i.e., the center of circle is located in thesupporting layer 51), but the present disclosure in not limited thereto.For example, as shown in FIG. 5B, the center of circle (not labeled) ofthe arc surface 511 can be located in the packaging compound 53.

As shown in FIGS. 2, 5A, and 6, the combining layer 52 is substantiallyin a square ring shape or a rectangular ring shape, and an inner edge ofthe combining layer 52 is preferably connected to the an outer edge ofthe spacing region 212 of the sensor chip 2. That is to say, the spacingregion 212 is provided for separating the combining layer 52 from thesensing region 211. The combining layer 52 is disposed on the supportinglayer 51 and the first portion of the top surface 21, the latter ofwhich is disposed between the first edge 213 and the spacing region 212,and a portion of the combining layer 52 disposed on the supporting layer51 (as shown in FIG. 5A) is further disposed on the second portion ofthe top surface 21 between the second edge 214 and the spacing region212. An area of the second portion of the top surface 21 is preferablysmaller than that of a portion of the spacing region 212 connected tothe second portion of the top surface 21. In other words, in otherembodiments of the present disclosure, when the portion of the combininglayer 52 disposed on the supporting layer 51 is not disposed on the topsurface 21, the second edge 214 of the top surface 21 is an outer edgeof the spacing region 212.

Specifically, a width and a height of the portion of the combining layer52 disposed on the supporting layer 51 (as shown in FIG. 5A) aresubstantially equal to that of a portion of the combining layer 52disposed on first portion of the top surface 21 (as shown in FIG. 6). Asurrounding side 521 of the combining layer 52 arranged distant from thesensing region 211 includes an arc surface 521 having a center of circlelocated in the packaging compound 53. A largest distance D3 (as shown inFIG. 5A) between the arc surface 521 of the combining layer 52 and thesensing region 211 is preferably and substantially equal to a distanceD4 (as shown in FIG. 6) between the first edge 213 and the sensingregion 211. In a cross-section of the sensor package structure 100perpendicular to the upper surface 11 (as shown in FIG. 5A), the arcsurface 521 of the combining layer 52 and the arc surface 511 of thesupporting layer 51 are in an S-shape, but the present disclosure is notlimited thereto (i.e., FIG. 5B).

Moreover, a part of each metal wire 3 is embedded in the combining layer52. In other words, each connecting pad 215 and a part of thecorresponding metal wire 3 connected thereto in the present embodimentare embedded in the combining layer 52. However, in other embodiments ofthe present disclosure, each connecting pad 215 and a part of thecorresponding metal wire 3 connected thereto can be not embedded in thecombining layer 52.

In addition, as shown in FIG. 1, a portion the second surface 42 of thetranslucent layer 4 is adhered to the combining layer 52, so that thesecond surface 42 of the translucent layer 4, the combining layer 52,and the top surface 21 of the sensor chip 2 surroundingly co-define anenclosed space 6, and the sensing region 211 of the sensor chip 2 isarranged in the enclosed space 6. The second surface 42 has a fixingregion 421 arranged outside the portion of the second surface 42 adheredto the combining layer 52, and the fixing region 421 is in a square ringshape or a rectangular ring shape.

As shown in FIGS. 1, 5A, and 6, the packaging compound 53 is disposed onthe upper surface 11 of the substrate 1 and covers the surrounding side23 of the sensor chip 2, the outer side 511 of the supporting layer 51,the surrounding side 521 of the combining layer 52, and the surroundingside 43 and the fixing region 421 of the translucent layer 4. Each ofthe metal wires 3 in the present embodiment is embedded in the packagingcompound 53 and the combining layer 52, and the apex 31 of each of themetal wires 3 is embedded in the packaging compound 53. However, inother embodiments of the present disclosure, each of the metal wires 3can be embedded entirely in the packaging compound 53.

Specifically, the first surface 41 of the translucent layer 4 and anadjacent surface of the packaging compound 53 (i.e., the top surface ofthe packaging compound 53 as shown in FIG. 1) have an angle Φ within arange of 90˜180 degrees, and the angle Φ is preferably within a range of115˜150 degrees. A surrounding side surface of the packaging compound 53other than the top surface and the bottom surface is substantially flushwith a surrounding side surface of the substrate 1. Moreover, thepackaging compound 53 in the present embodiment is not disposed on thefirst surface 41 of the translucent layer 4, but the packaging compound53 in other embodiments of the present disclosure can be disposed on apart of the first surface 41 (i.e., a periphery part of the firstsurface 41) of the translucent layer 4.

In summary, the sensor chip 2 in the present embodiment, which has thesecond portion provided without any connecting pad 215, can be adaptedin the sensor package structure 100. That is to say, the sensor packagestructure 100 of the present embodiment can be suitable to package thesensor chip 2 which has a smaller size. Furthermore, the sensor packagestructure 100 can also package the smaller sensor chip 2 by embeddingpart of each metal wire 3 in the combining layer 52.

The translucent layer 4 can be firmly fixed at a predetermined positionby adhering the packaging compound 53 to the arc surface 511 of thesupporting layer 51, the arc surface 521 of the combining layer 52, andthe surrounding side 43 and the fixing region 421 of the translucentlayer 4. Moreover, the translucent layer 4 can be maintained to notcontact each metal wire 3, so that the translucent layer 4 issubstantially parallel to the top surface 21 of the sensor chip 2,thereby providing a better reliability of the sensor package structure100.

The supporting layer 51 is formed in one process, and the combininglayer 52 is later formed in another process, so that the supportinglayer 51 is formed to be an extension for a shorter portion of thesensor chip 2 (i.e., the second portion of the top surface 21 betweenthe sensing region 211 and the second edge 214). Thus, the supportinglayer 51 can provide a space sufficient to receive the combining layer52, preventing the combining layer 52 from contacting the sensing region211.

In addition, the sensor package structure 100 as shown in FIGS. 1 to 6can be adjusted according to practical needs, but as the presentdisclosure cannot disclose all varieties of configurations, thefollowing description will only disclose some exemplary configurationsof the sensor package structure 100.

As shown in FIG. 7, the surrounding side 43 of the translucent layer 4is in a step shape and is embedded in the packaging compound 53. An areaof the first surface 41 is smaller than that of the second surface 42.However, in other embodiments of the present disclosure, the area of thefirst surface 41 can be greater than that of the second surface 42.

As shown in FIG. 8, the sensor package structure 100 can further includea molding compound 54 disposed on a top surface of the packagingcompound 53. A top surface of the molding compound 54 is substantiallyparallel to the first surface 41 of the translucent layer 41, and asurrounding side surface of the molding compound 54 other than the topsurface and the bottom surface is coplanar with a surrounding sidesurface of the packaging compound 53, but the present disclosure is notlimited thereto. Moreover, the top surface of the molding compound 54can be substantially coplanar with the first surface 41 of thetranslucent layer 41.

As shown in FIG. 9, the packaging compound 53 can be a molding compound,and the first surface 41 of the translucent layer 4 is substantiallyparallel to an adjacent surface of the packaging compound 53. Moreover,the first surface 41 of the translucent layer 4 and the adjacent surfaceof the packaging compound 53 preferably have an angle Φ of 180 degrees.

Second Embodiment

Reference is made to FIG. 10, which illustrates a second embodiment ofthe present disclosure. The present embodiment is similar to the firstembodiment, except that in the second embodiment, the combining layer 52and the supporting layer 51 are replaced by a first combining layer 55and a second combining layer 56. Specifically, in the presentembodiment, the supporting layer 51 and a portion of the combining layer52 disposed on the supporting layer 51 (as shown in FIG. 5) as disclosedin the first embodiment are adjusted to be formed in one process and areco-defined as the second combining layer 56, and the other portion ofthe combining layer 52 (as shown in FIG. 6) is adjusted to be formed inanother process and is defined as the first combining layer 55, but thepresent disclosure is not limited thereto. The structural features ofthe present embodiment different from the first embodiment are disclosedas follows.

The first combining layer 55 is disposed on the first portion of the topsurface 21 between the first edge 213 and the spacing region 212. Thesecond combining layer 56 is disposed on the upper surface 11 of thesubstrate 1 and is arranged adjacent to the second edge 214 of thesensor chip 2 (i.e., the second combining layer 56 contacts the sidesurface 231 of the sensor chip 2). The second combining layer 56 can befurther disposed on the second portion of the top surface 21 between thesecond edge 214 and the spacing region 212, and an area of the secondportion of the top surface 21 is smaller than that of a portion of thespacing region 212 connected to the second portion of the top surface21. A height of the second combining layer 56 with respect to the uppersurface 11 of the substrate 1 is substantially equal to that of thefirst combining layer 55 with respect to the upper surface 11 of thesubstrate 1.

Moreover, a largest distance between an upper half of an outer side 561of the second combining layer 56 and the sensing region 211 issubstantially equal to a distance between the first edge 213 and thesensing region 211. An outer side 551 of the first combining layer 55arranged distant from the sensing region 211 includes an arc surface 551having a center of circle located in the packaging compound 53. In across-section of the sensor package structure 100 perpendicular to theupper surface 11 of the substrate 1, the outer side 561 of the secondcombining layer 56 arranged distant from the sensor chip 2 is in anS-shape, but the present disclosure is not limited thereto (e.g., FIG.5B).

A portion of the second surface 42 of the translucent layer 4 is adheredto the first combining layer 55 and the second combining layer 56. Thesecond surface 42 has a fixing region 421 arranged outside the portionof the second surface 42 adhered to the first combining layer 55 and thesecond combining layer 56.

The packaging compound 53 is disposed on the upper surface 11 of thesubstrate 1 and covers the surrounding side 23 of the sensor chip 2, theouter side 551 of the first combining layer 55, the outer side 561 ofthe second combining layer 56, and the surrounding side 43 and thefixing region 421 of the translucent layer 4. A part of each metal wire3 and each welding pad 111 are embedded in the packaging compound 53.

Third Embodiment

Reference is made to FIGS. 11 and 12, which illustrate a thirdembodiment of the present disclosure. The present embodiment is similarto the first embodiment, except that the sensor package structure 100 ofthe third embodiment is provided without any supporting layer 51; thatis to say, the edges of the top surface 21 of the sensor chip 2 in thepresent embodiment are first edges 213.

It should be noted that the size of the sensor package structure 100 asdisclosed in the above three embodiments can be reduced. Specifically,as shown in FIG. 12, a distance D5 between the surrounding side 43 ofthe translucent layer 4 and an adjacent side of the packaging compound53 is substantially 300˜500 μm, a largest distance D6 between asurrounding side of each of the welding pads 111 and an adjacent portionof the surrounding side 23 of the sensor chip 2 is substantially 200˜350μm, and a distance D7 between the portion of the surrounding side 23 ofthe sensor chip 2 adjacent to at least one of the welding pads 111 andan adjacent side surface of the packaging compound 53 is substantially375˜575 μm. Thus, the size of the sensor package structure 100 issmaller than that of the conventional sensor package structure, and theamount of the packing compound 53 of the sensor package structure 100 isless than that of the conventional sensor package structure, so that thethermal expansion and contraction of the packaging compound 53 generatesless stress to the sensor package structure 100, thereby increasing thereliability of the sensor package structure 100.

The descriptions illustrated supra set forth simply the preferredembodiments of the present invention; however, the characteristics ofthe present invention are by no means restricted thereto. All changes,alterations, or modifications conveniently considered by those skilledin the art are deemed to be encompassed within the scope of the presentinvention delineated by the following claims.

What is claimed is:
 1. A sensor package structure, comprising: asubstrate having an upper surface and a lower surface opposite to theupper surface, wherein the substrate includes a plurality of weldingpads formed on the upper surface; a sensor chip having a top surface anda bottom surface opposite to the top surface, the bottom surface of thesensor chip being disposed on the upper surface of the substrate, thetop surface having a sensing region and a spacing region arranged aroundthe sensing region, wherein the top surface has at least one first edgeand at least one second edge, a distance between the at least one firstedge and the spacing region is greater than a distance between the atleast one second edge and the spacing region, the sensor chip includes aplurality of connecting pads formed on a first portion of the topsurface between the at least one first edge and the spacing region, anda second portion of the top surface between the at least one second edgeand the spacing region is provided without any connecting pad; aplurality of metal wires, wherein one ends of the metal wires arerespectively connected to the welding pads, and the other ends of themetal wires are respectively connected to the connecting pads; atranslucent layer having a first surface and a second surface oppositeto the first surface, wherein the second surface of the translucentlayer faces toward the top surface of the sensor chip; and an adhesivedisposed on the upper surface of the substrate and covering asurrounding side of the sensor chip, the first portion of the topsurface, and a surrounding side and a portion of the second surface ofthe translucent layer, wherein at least part of each of the metal wiresand each of the connecting pads are embedded in the adhesive, whereinthe first surface of the translucent layer is at least partially exposedfrom the adhesive, and the adhesive includes: a supporting layerarranged adjacent to the at least one second edge, wherein an edge ofthe supporting layer arranged distant from the substrate has a heightsubstantially equal to a height of the upper surface of the sensor chip;a combing layer disposed on the supporting layer and the first portionof the top surface of the sensor chip, wherein the portion of the secondsurface of the translucent layer is adhered to the combing layer; and apackaging compound disposed on the upper surface of the substrate andcovering the surrounding side of the sensor chip, an outer side of thesupporting layer arranged distant from the sensor chip, a surroundingside of the combining layer arranged distant from the sensing region,and the surrounding side of the translucent layer, wherein at least partof each of the metal wires and each of the welding pads are embedded inthe packaging compound.
 2. The sensor package structure as claimed inclaim 1, wherein the outer side of the supporting layer includes an arcsurface having a center of circle located at an interior side of thepackaging compound.
 3. The sensor package structure as claimed in claim1, wherein the surrounding side of the combining layer includes an arcsurface having a center of circle located in the packaging compound. 4.The sensor package structure as claimed in claim 1, wherein a distancebetween the surrounding side of the combining layer and the sensingregion is substantially equal to a distance between the at least onefirst edge and the sensing region.
 5. The sensor package structure asclaimed in claim 1, wherein the combining layer is further disposed onthe second portion of the top surface between the at least one secondedge and the spacing region.
 6. The sensor package structure as claimedin claim 5, wherein an area of the second portion of the top surface issmaller than that of a portion of the spacing region connected to thesecond portion of the top surface.
 7. The sensor package structure asclaimed in claim 1, wherein a projecting area defined by orthogonallyprojecting the sensor chip onto the second surface is entirely locatedin the second surface, the second surface has a fixing region arrangedoutside the portion of the second surface adhered to the combininglayer, and the packaging compound covers the fixing region.
 8. A sensorpackage structure, comprising: a substrate having an upper surface and alower surface opposite to the upper surface, wherein the substrateincludes a plurality of welding pads formed on the upper surface; asensor chip having a top surface and a bottom surface opposite to thetop surface, the bottom surface of the sensor chip being disposed on theupper surface of the substrate, the top surface having a sensing regionand a spacing region arranged around the sensing region, wherein the topsurface has at least one first edge and at least one second edge, adistance between the at least one first edge and the spacing region isgreater than a distance between the at least one second edge and thespacing region, the sensor chip includes a plurality of connecting padsformed on a first portion of the top surface between the at least onefirst edge and the spacing region, and a second portion of the topsurface between the at least one second edge and the spacing region isprovided without any connecting pad; a plurality of metal wires, whereinone ends of the metal wires are respectively connected to the weldingpads, and the other ends of the metal wires are respectively connectedto the connecting pads; a translucent layer having a first surface and asecond surface opposite to the first surface, wherein the second surfaceof the translucent layer faces toward the top surface of the sensorchip; and an adhesive disposed on the upper surface of the substrate andcovering a surrounding side of the sensor chip, the first portion of thetop surface, and a surrounding side and a portion of the second surfaceof the translucent layer, wherein at least part of each of the metalwires and each of the connecting pads are embedded in the adhesive, andwherein the adhesive includes: a supporting layer arranged adjacent tothe at least one second edge, wherein an edge of the supporting layerarranged distant from the substrate has a height substantially equal toa height of the upper surface of the sensor chip; a combining layerdisposed on the supporting layer and the first portion of the topsurface of the sensor chip, wherein the portion of the second surface ofthe translucent layer is adhered to the combining layer; a packagingcompound disposed on the upper surface of the substrate and covering thesurrounding side of the sensor chip, an outer side of the supportinglayer arranged distant from the sensor chip, a surrounding side of thecombining layer arranged distant from the sensing region, and thesurrounding side of the translucent layer, wherein at least part of eachof the metal wires and each of the welding pads are embedded in thepackaging compound.
 9. The sensor package structure as claimed in claim8, wherein the outer side of the supporting layer includes an arcsurface having a center of circle located at an interior side of thepackaging compound.
 10. The sensor package structure as claimed in claim8, wherein the surrounding side of the combining layer includes an arcsurface having a center of circle located in the packaging compound. 11.The sensor package structure as claimed in claim 8, wherein a distancebetween the surrounding side of the combining layer and the sensingregion is substantially equal to a distance between the at least onefirst edge and the sensing region.
 12. The sensor package structure asclaimed in claim 8, wherein the combining layer is further disposed onthe second portion of the top surface between the at least one secondedge and the spacing region.
 13. The sensor package structure as claimedin claim 12, wherein an area of the second portion of the top surface issmaller than that of a portion of the spacing region connected to thesecond portion of the top surface.
 14. The sensor package structure asclaimed in claim 8, wherein a projecting area defined by orthogonallyprojecting the sensor chip onto the second surface is entirely locatedin the second surface, the second surface has a fixing region arrangedoutside the portion of the second surface adhered to the combininglayer, and the packaging compound covers the fixing region.